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Top view of a sealing ring section on the silicon wafer after bonding... | Download Scientific Diagram
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Metal‐bonding‐based hermetic wafer‐level MEMS packaging technology using in‐plane feedthrough: Hermeticity and high frequency characteristics of thick gold film feedthrough - Moriyama - 2019 - Electrical Engineering in Japan - Wiley Online Library
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US9728474B1 - Semiconductor chips with seal rings and electronic test structures, semiconductor wafers including the semiconductor chips, and methods for fabricating the same - Google Patents
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Seal ring bonding structures Patent Grant Low , et al. October 20, 2 [VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.]
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Figure 3 from Plasma inducted wafer arcing in back-end process and the impact on reliability | Semantic Scholar
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SEMICONDUCTOR DEVICE WITH SEAL RING WITH EMBEDDED DECOUPLING CAPACITOR - diagram, schematic, and image 01
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Figure 3 from Investigation on seal-ring rules for IC product reliability in 0.25-mum CMOS technology | Semantic Scholar
![Top view of a sealing ring section on the silicon wafer after bonding... | Download Scientific Diagram Top view of a sealing ring section on the silicon wafer after bonding... | Download Scientific Diagram](https://www.researchgate.net/profile/Junchun-Yu-2/publication/224604655/figure/fig2/AS:302670146490370@1449173594664/a-Top-view-of-three-types-of-microcavities-with-metal-sealing-rings-on-wafer-1-and_Q320.jpg)